(一) FR-4,FR-4.1,FR-5單面板及雙面板認證申請
(二) cem-1,cem-3單面板及雙面板申請
(三) FR-1,FR-3單面板及雙面板申請
(四) FR-4多層板申請
(五) 單面鋁基板僅燃燒認證和全認證申請
(六) 雙面鋁基板僅燃燒認證和全認證申請
(七) 多層鋁基板僅燃燒認證和全認證申請
(八) 銅基板 單面,雙面,多層  僅燃燒認證和全認證申請
(九) 柔性線路板(軟板)僅燃燒認證和全認證申請
(十) 軟硬結合板僅燃燒認證和全認證申請
(十一) 線路板基材認證申請
(十二) 線路板油墨認證申請
(十三) 覆蓋膜,電磁膜,屏蔽膜認證申請
(十四) 已有UL,增加CUL認證申請
(十五) 其他認證申請
(十六) XPC板材 22f板材 HB板材 V0板材
1 Scope

1.1 These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.

1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.

1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.

1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances – that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F.
Cover
Transmittal
Table of Contents
Body
INTRODUCTION
1 Scope
2 Glossary
3 Units of Measurement
4 Measurement Accuracy and Testing Conditions
5 Supplementary Test Procedures
6 References
7 General
CONSTRUCTION
8 General
9 base Materials
10 Conductors
11 Adhesives for Conductor Bonding
12 Processes
13 Permanent Coatings
14 Plugged-Hole Materials
15 Embedded Components
16 Singlelayer (Singlesided and doublesided) Printed-Wiring Boards
17 Multilayer Printed-Wiring Boards
18 metal base Printed-Wiring Boards
19 Flexible Printed-Wiring Boards
20 Variations In Printed-Wiring Board Construction
PERFORMANCE
21 Test Samples
22 Data Collection
23 Microsection Analysis
24 Thermal Shock
25 Flammability
26 Bond Strength
27 Delamination and Blistering
28 Dissimilar Dielectric Materials Thermal Cycling Test
29 Plating Adhesion
30 Conductive Paste Adhesion Test
31 Dielectric Materials Intended for Use in Fabricating High Density Interconnect (HDI) Type Constructions
32 Silver Migration Test
MARKINGS
33 General

FOLLOW-UP INSPECTION

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